MediaTek released two new system on a chip (SoC) for premium HP at MWC 2022, namely Dimensity 8100 and Dimensity 8000.
Both the Dimensity 8100 and Dimensity 8000 are made using TSMC's 5nm manufacturing process, which is claimed to be very efficient for octa-core CPUs. The Dimensity 8100 integrates four premium Arm Cortex-A78 cores clocking up to 2.85GHz, and the Dimensity 8000 has four Cortex-A78 cores operating up to 2.75GHz.
"You could say MediaTek's Dimensity 8000 series is the 'sister' of our flagship Dimensity 9000 chip. That means it brings next-class features and energy efficiency to the premium smartphone market," said CH Chen, Deputy General Manager of MediaTek's Wireless Communications Business Unit. , in a statement received by us, Wednesday (2/3/2022).
The two chips combine the Arm Mali-G610 MC6 GPU with MediaTek HyperEngine 5.0 gaming technology, which is claimed to have great efficiency and can extend gaming time, of course with a maintained frame rate -- claimed up to 170fps in the Dimensity 8100 and 140fps in the Dimensity 8000.
For RAM and storage it is a combination of LPDDR5 and UFS 3.1, to ensure a very adequate data flow.
The new Dimensity 8000 series also uses MediaTek's Open Source Architecture to give device manufacturers the flexibility to customize and differentiate features, so they can create 5G smartphones and 5G experiences that truly stand out.
The MediaTek APU 580 5th generation AI processing unit is also now integrated in the Dimensity 8000, which strikes a balance of performance and efficiency in optimizing the AI experience for multimedia, gaming, camera and video.
"With the Dimensity 8000, MediaTek gives vendors more options to balance performance and price while still offering flagship-level gaming and AI capabilities," said Avi Greengart, President of Market Advisory Firm Techsponential, in the same statement.
The features of the Dimensity 8000 series of chips include:
Supports up to 200MP cameras and 4K60 HDR10+ videography.
MediaTek's latest noise reduction and AI-based unblur technique in very low light environments.
Simultaneous dual camera HDR video recording. Users can record with the front and rear cameras or two different rear lenses – for example, wide + tele – simultaneously.
Advanced 5G 3GPP R16-ready modem to boost sub-6GHz performance using 2CCCarrier Aggregation.
MediaTek's 5G UltraSave 2.0 power-saving upgrade kit for increased efficiency.
Supports Wi-Fi 6E and Bluetooth 5.3 for seamless coexistence of Wi-Fi connectivity and Bluetooth peripherals.
Phones with Dimensity 8100 and Dimensity 8000 are expected to be available in the market in the first quarter of 2022.