This year, Sony has updated their PlayStation 5 video game console by using a cooling system that comes in a smaller size than usual. Recently, it has just become known that this is also because this updated console uses a processing chip that is also developed using a new process.
This latest SoC is named Oberon Plus, and is developed using TSMC's 6nm process, slightly different from the previous Oberon SoC which was developed with the N7 process by the same company.
Oberon Plus reportedly comes with a size of 260mm2, smaller than the previous 300mm2, and comes with 18 percent logic density compared to the previous chip. The main advantage present in this latest SoC is that it consumes a lower amount of electricity and produces less heat.
In terms of performance, this SoC is seen to come with roughly the same capabilities as the previous chip, and for Sony this is good enough because it can reduce production costs for this console without any drop in performance. This chip is used in the PlayStation 5 console with model number CFI-1202.
However, Sony has recently been seen increasing the price of this console, perhaps due to the increase in the cost of other materials, and with speculation that the PlayStation 5 console will come with a new model with a removable disk drive around 2024.