MediaTek took part in the CES 2023 exhibition which took place in Las Vegas, USA. This chip vendor from Taiwan is showing off WiFi 7 products and Genio 700 chips for IoT devices and smart homes.
According to MediaTek, Wi-Fi 7 technology will enable a variety of devices, including residential gateways, mesh routers, TVs, streaming devices, smartphones, tablets, laptops and more, to stay connected and reliably at all times.
WiFi 7 uses 320MHz bandwidth and 4096-QAM modulation to enhance the overall user experience. The available Multi-Link Operation (MLO) also makes it easy for Wi-Fi connections to gather channel speed and reduce link interference in densely populated environments to keep applications running smoothly.
"Last year, we demonstrated the world's first Wi-Fi 7 technology and now we are honored to demonstrate the significant progress we have made in building a more complete ecosystem of products," said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity. MediaTek Business Unit in its official statement.
Wi-Fi 7 also includes a unique Multi-Link Operation (MLO). Enables WiFi connections to have a wider coverage area and increase the number of connected devices.
The devices on display at CES 2023 use MediaTek's latest Filogic chip, which incorporates Wi-Fi 7 access point technology for the broadband carrier, retail router line and enterprise market. Additionally, the Filogic 380 chipset is used to deliver Wi-Fi 7 connectivity to all client devices, including smartphones, tablets, laptops, TVs and streaming devices.
Utilizing a 6nm process, MediaTek's Wi-Fi 7 solution delivers a 50% reduction in main power consumption, a 25x reduction in CPU usage, and a 100x reduction in MLO switch latency compared to competing options.
In addition to introducing consumer-ready Wi-Fi 7 products, MediaTek also announced that it has successfully completed interoperability testing for Automatic Frequency Coordination (AFC) on MediaTek Filogic Wi-Fi 7 and Wi-Fi 6E chips.
Genio 700 chips
The Genio 700 chip is designed for internet goods (IoT) products applied to smart home, smart retail, and industrial IoT
other. At CES 2023, the MediaTek booth also demonstrated this latest chipset.
MediaTek made the Genio 700 with a 6nm fabrication that offers two ARM A78 cores running at 2.2Ghz and six ARM A55 cores at 2.0GHz and provides an AI 4.0 TOP accelerator. This chipset also supports FHD60 + 4K60 displays and Image Signal Processor
(ISP) for a better picture.
Not only that, SDK Genio 700 also makes it easy for IoT product designers to customize products using Yocto Linux, Ubuntu, and Android. With this support, customers can easily develop products easily, regardless of the type of application.
"When we released the Genio IoT product series last year, we designed the platform with the scalability and development support that brands (IoT manufacturers) need in mind, thereby paving the way for opportunities for continuous growth," said Richard Lu, Vice President of MediaTek IoT Business Units.
"With a focus on industrial and smart home products, the Genio 700 is the perfect addition to the product lineup, and ensures we can provide our customers with the widest possible range of support."