The hotter the processor of a cellphone, the greater the cooler needed to tame it.
For example, the latest Samsung Galaxy S23 trio, all use a special chipset from Qualcomm. The chip is Snapdragon 8 Gen 2 which is specifically modified for the Samsung Flagship HP.
This modification is named Snapdragon 8 Gen 2 for Galaxy. Interestingly, the modification is not intended to make the chip more cool but instead made faster, which of course will make the chip hotter.
The difference is compared to the usual version, the main core chip is increased from 3.2 GHz to 3.36 GHz. Then the GPU speed is increased from 680 MHz to 719 MHz.
This higher speed will certainly produce higher heat. Plus, the last few chip Qualcomm does require special handling from the HP manufacturer. Especially to tame the heat, which is usually tamed by doing throttling or decreases the speed of chip when it reaches a certain temperature.
Well, Samsung has a different approach to tame the heat of Snapdragon 8 Gen 2 for Galaxy. Namely by giving an extra large vapor chamber in all Galaxy S23 variants. Unlike the Galaxy S22 trio, the large vapor chamber only exists in the Ultra variant.
For information, vapor chamber is a component that functions to move heat from chips to other parts of a cooler cellphone. The greater the vapor chamber, the bigger and faster the heat can be discarded.
From the animation posted by Ice Universe on Twitter, a difference in the size of the Galaxy S22 cooler, which only uses a graphite layer for the cooler, becomes a large chamber vapor on the Galaxy S23.
Galaxy S22, as quoted by our GSM Arena, Monday (6/2/2023) could not maintain its fast performance for a long time. This is because the cooling system is not large enough, so the system must reduce its speed, or throttling.
The hope is that on the Galaxy S23 it doesn't happen again, because it already uses a vapor chamber whose ability is higher than the graphite pad.