The mobile phone industry uses SIM, Micro SIM, Nano SIM, and eSIM technologies to connect various devices to cellular networks. At WMC 2023, Qualcomm and Thales announced the first processor chips that support a new technology called iSIM (Integrated SIM).
iSIM is a SIM chip built directly into the processor chip with the Snapdragon 8 Gen 2 being the first to support it. With iSIM no additional chip needs to be connected to the device's motherboard as eSIM requires now.
It maintains all the security features inherent in eSIM and exceeds the standards set by the GSMA. With iSIM, the internal space of the device will be able to be used better which leads to a bigger battery for example.
Although the Snapdragon 8 Gen 2 chip is equipped with an iSIM system, the first devices that will support it have not been announced by Qualcomm. Whether existing devices can use it through a software update is also unknown.
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