AMD is expected to show their new series of processing chips in the third quarter of this year, which is AMD Zen 5, and recently, it seems that some details about the processing chips have been shown.
Harukaze5719 on Twitter has shown a slide showing some of the new things we can expect to see through this AMD Ryzen 8000 chip. The first is that it will use the new AMD Zen 5 processing chip, where it will be built using TSMC's latest 3nm and 4nm processes.
AMD is also reported to launch three variants of this processing chip, including Zen 5, Zen 5c and Zen 5 3D V-cache. These processing chips are also expected to be present with a TDP consumption range from 65W to 170W depending on the usage pattern, whether for normal users or for data centers.
From this slide it can also be seen an interesting detail about the AMD Ryzen 7000 processing chip, where it seems that it will come with a choice of models that will be equipped with RDNA3 graphics chips, where before, the AMD Zen 3 processing chip only had RDNA2 graphics chips built into it.
For now, we just have to wait when AMD will reveal more details about this processing chip. AMD has also confirmed that this processing chip will support existing AM5 motherboards.