Honor has now confirmed that its new foldable screen device will arrive on July 12. To be known as the Honor Magic V2, it is not certain whether the date is limited to the launch in China alone, or there is a possibility that it will also take place globally. In the meantime Honor is also seen to be still puzzled about the internal hardware of the device.
But early rumors that the device may be powered by a Snapdragon 8+ Gen 1 chip, a memory option of up to 16GB of RAM and a maximum internal storage of 512GB. As an option, Honor is also expected to provide a variant with the latest Snapdragon 8 Gen 2 chip on the device later.
Next the display size is also still ambiguous, but an AMOLED LTPO 2K panel that supports refresh rate and high-frequency dimming technology may be used. All of these are however just initial expectations, which in fact we can expect more other interesting features to be provided for example such as waterproofing or wireless charging.
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