Apart from HBM3 Gen2 memory, Micron is also seen to have introduced a DDR5 integrated memory chip with 8-layer technology with a capacity of 32Gb. this is an improvement to the 24Gb memory chip that was also launched by them before.
This integrated memory chip is developed using their latest 1-beta process, and what's interesting about this latest DDR5 memory chip is that in theory, a memory module packed with it can reach a theoretical capacity of 1TB.
For now, Micron has yet to confirm details on the performance of this memory chip, but it is expected that it will at least have data transfer speeds that can be achieved by their existing DDR5 memory chips.
As said before, Micron can technically develop DDR5 memory modules with a capacity of 1TB, but for large-scale memory production, the company said that they will develop DDR5 memory modules with a capacity of 192GB and 256GB for data center use starting next year.
Micron did not show any offerings for the 512GB and 1TB capacities, but some reports suggest that the capacities will be developed in small quantities and only for certain customers.