The Washington-based Semiconductor Industry Association (SIA) claims Huawei is secretly building a number of chip manufacturing plants to circumvent technology barriers imposed by the United States over the past four years. According to documents seen by Bloomberg, Huawei took over two fabrication plants and is building three more new factories.
By hiding the real owners of these factories, Huawei will once again be able to access the latest chip manufacturing technology belonging to the United States which was blocked after allegedly posing a risk to national security. Huawei denies these allegations and has already filed a lawsuit against the U.S. Department of Commerce.
SIA also said Huawei received $30 billion in funding from the Chinese government to build their chip manufacturing facility. The Bureau of Industry and Security at the U.S. Department of Commerce when contacted said they were monitoring the allegations. Previously two other companies Fujian Jinhua Integrated Circuit Co. and Pengxinwei IC Manufacturing Co (PXW) were included in the entity list when their relationship with Huawei was discovered.
Huawei previously said it would return to offering devices with 5G by the end of 2023 with standalone technology without the involvement of the United States. How it was achieved is a mystery as they were not given access to this 5G chip technology. Huawei has not given any official statement about the SIA report.