Oppo Find X7 Pro Prototype Leaked With Thick And Big Camera Bump


 The range of devices under the Oppo Find X series often focuses on offering balanced specifications that include quite good performance and camera systems. Not only that, but the featured design also has its own value.



For example, the prototype for the Find X7 Pro was found leaked through viral image sharing. Among the most prominent parts is the thick and large main camera hump. It is octagon-shaped which has a symmetrical shape with eight sides of equal length. Then it can also be said to be thicker and bigger than the bump on the previous Find X6 Pro.



It is still unclear about the camera configuration that will be supported but it is believed to have two periscope lenses. At the same time, it can also be equipped with a main sensor based on the LYT900 which is a 1″ sensor with Hasselblad support. It is expected to be equipped with the latest Snapdragon 8 Gen 3 chip as well as able to reflect Oppo's ongoing commitment to understand the latest user preferences.


No official launch date is known at the moment but it is expected to take place around next January.

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