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Honor has scheduled a new product launch event that includes the Magic6 series smartphones next week. Unwilling to remain a mystery Honor publicly shared the official design for the device through a recent share on Weibo.
It seems that the body construction has not changed much with the sides being rounded for comfort when holding. Minor changes were made by Honor on the camera bump which is now more square than before.
Inside there are three sensors provided with one of them supporting periscope telephoto. Followed by a flash light and maybe a 3D ToF sensor placed together. The hump is also placed in the middle making the design of the device look stable and symmetrical.
The green hue is once again Honor's choice, especially in decorating the entire back panel space. Then, abstract patterns are combined at certain angles to give a more interesting effect.
The front panel is also not shown in the same partnership. However, it has been leaked before with a hole-punch screen for the placement of the front camera. All questions will definitely be answered after the official launch later.