.webp)
TSMC, the number one semiconductor chip maker and manufacturer in the world has recently announced that they have plans to be the first company to manufacture the first semiconductor chip with 1 trillion transistors in the future.
Before that, the technology company from Taiwan is seen to start developing a semiconductor chip with 200 billion transistors in it first. This is seen to happen in a few more years using the 2nm and 1nm construction process, including the N2 and N2P production nodes and the 1.4nm and 1.0nm A14 and A10 production nodes which are expected to be fully activated around 2030 which will develop chips with 1 trillion this transistor.
According to TSMC, the chip product produced by them that has the most number of transistors is the NVIDIA GH100 artificial intelligence chip that has 80 billion transistors built into it. The GH100 is built using the 4nm process this year.
TSMC is expected to activate their 3nm node next year, and NVIDIA is expected to take advantage of that node with their GH200 graphics card that will be launched next year, and is expected to come with 100 thousand built-in transistors.
In making this semiconductor chip a reality, the company is seen to be using some techniques like 3D stacking like what Intel did with their Foveros packaging. It will be interesting to see what TSMC will do to make their ambition a reality in another seven years.