Redmi A3 Leaked With Round Camera Bump


 The Redmi A series is known as a device marketed at an affordable price. It is also often the choice among students and parents who are looking for a device for daily use only.



Further sharing the generation for it which is the Redmi A3 was found to be leaked through several viral images. Significant changes can be seen in the design of the rear panel which contains a round camera bump, which can even be seen similar to the concept used by Xiaomi on the Ultra device. Then the flat back panel with rounded sides also complements it.



The device is expected to be offered in various color options including black as shown in the viral image. It also comes with a red and white packaging box. It is still not clear about the specifications of the device, but with this leak, its introduction is expected to be held in the near future.

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