Last year Qualcomm launched the Sound S7 and Sound S7 Pro Gen 1 audio chips for flagship audio products. Today the Qualcomm S5 Gen 3 and Qualcomm S3 Gen 3 audio chips were launched for affordable audio accessories. Interestingly, even for audio there is AI support because the S5 Gen 3 supports more than 50x the power of AI.
This chip wants to offer premium audio features at a premium mid-range price. It can be used on earphone sets, headphone sets and even speakers. Qualcomm promises 50x AI processing power from inside the device, 1.5x more memory than the S5 Gen 2, has a dedicated AI core to improve audio quality with low power, supports the 4th generation Qualcomm Adaptive ANC system, HiFi stereo audio and Bluetooth 5.4 that supports connectivity LE as well as Auracast.
This chip can also adjust audio products for users with hearing problems because it can tune itself automatically. As for the AI feature, Qualcomm said it varies by manufacturer but one of the things it wants to emphasize is improving the microphone with AI will focus on listening to the user's voice instead of the voice around the user. For now it is still not sure which audio product will use this Qualcomm S5 Gen 3.
This chip also uses the same Bluetooth 5.4 system so it supports LE low power connectivity. This chip is targeted for compact-sized audio products, again in the affordable category. It supports Qualcomm TrueWireless Mirroring, physical button controls that invoke the digital assistant, Google Fast Pair can be used and even basic ANC support.
S3 Gen 3 will also allow audio product manufacturers to include fit and listen test features, spatial audio support, pulse scanners and other health tracking features on affordable audio products. Vivo is confirmed to be one of the first to use this chip but there is still no word on which audio product.