MediaTek announced two new mid-range chips through the Dimensity 7300 and Dimensity 7300X. Both use TSMC's 4nm build equipped with eight CPU cores. Also followed is the ability of artificial intelligence which has become a growing trend at the moment. In addition, the advantage can also be seen on the Dimensity 7300X which offers dual-display support which means it can be an attractive option for an affordable foldable device.
Specifically shared both chips offer eight CPU cores with a configuration of 4 x Cortex-A78 2.5GHz paired with 4 x Cortex-A55 2.0GHz. This is combined with the Arm Mali-G615 GPU which also supports LPDDR5/LPDDR4x based memory up to 6400Mbps and UFS 3.1 based storage. This chip also utilizes MediaTek HyperEngine technology aimed at smooth gaming performance with visually stunning graphics. In addition to using smart sources to optimize the 5G/WiFi connection, as well as supporting Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.
Through the ISP Imagiq 950 12-bit HDR chip, a camera sensor of up to 200MP and dual-video recording capabilities can be done simultaneously. The chip is also equipped with special technologies such as MCNR (Multi-Frame Noise Reduction) and HWFD (Hardware Face Detection) which are said to be able to improve the mobile photography experience to a better level. Other supported features include WFHD+ display at 120Hz refresh rate, Wi-Fi 6E connectivity and Bluetooth 5.4.