MediaTek launched the Dimensity 8250 as a new update to their premium mid-range chip lineup. It uses TSMC's 4nm build that has an integrated 5G modem (sub-6GHz SA, NSA, and 3CC), an artificial intelligence (AI) processor and better image capabilities. In general, what this chip offers is the same as the previous Dimensity 8200. But it is still able to offer more than adequate performance in its range.
Dimensity 8250 is equipped with eight CPU cores with a configuration of 1 x Arm Cortex-A78 3.1GHz, 3 x Arm Cortex-A78 3.0GHz and 4 x Arm Cortex-A55 2.0GHz. This is coupled with the Mali-G610 MC6 GPU which also supports up to four LPDDR5-6400 channels and UFS 3.1 based storage. The chip also leverages MediaTek HyperEngine MediaTek Adaptive technology for smooth gaming performance while extending battery life.
According to MediaTek, the chip can support a main camera sensor of up to 320MP and a maximum video recording capability of 4K60FPS. In addition to also using AI to reduce noise in the image while allowing the best zoom up to 2X to be made. Other supported features include WQHD+ display at 120Hz refresh rate, HDR10+ support, Wi-Fi 6E connectivity at speeds up to 4.7Gbps and Bluetooth 5.3.
Oppo Reno12 is expected to be the first device powered by this Dimensity 8250 chip. Oppo will officially announce it along with the pro version on May 23.