NVIDIA is expected to introduce their Blackwell processing chips for artificial intelligence and gaming graphics cards at the end of this year and early next year. The company appears to be choosing specific components for this latest offering, and they seem to be having a hard time with Samsung over HBM3 memory.
It was reported by Reuters that the HBM3 memory produced by Samsung, specifically the 8 and 12 chip stacks are facing overheating issues and causing issues for graphics cards that use this memory.
For now, NVIDIA is also reported to have already obtained this memory supply from Micron and also SK Hynix. In fact, most existing HBM3 memory supplies have been supplied by SK Hynix since 2022, and HBM3E since March this year.
Reuters further said that one of the reasons why this happened is because Samsung did not have a long period of time to develop this memory due to the sudden demand by NVIDIA and this prevented them from making any improvements in terms of temperature and excessive power consumption.
Samsung has also released a statement to Reuters regarding this report, saying that their HBM3 memory has no problems, just that some modifications need to be made for the client's needs, although in this case, they did not name NVIDIA as the client.
In the meantime, they also confirmed that their HBM3 memory is still in the testing phase, and they are always talking to various customers to improve the quality of their components.