Samsung is a well-known technology brand for electronic devices. They are also quite popular for offering internal components such as semiconductor chips used for memory, storage and also processing chips used by various other companies.
Recently, Samsung seems to confirm that they will introduce their own HBM 4 (High Bandwidth Memory) memory offering built using a technology called Samsung Advanced Interconnection Technology-D or SAINT-D.
This SAINT chip connection technology is not something new, and has already been used by Samsung for several other components such as SRAM and also other logic chips to be superimposed on their own logic chips such as the CPU.
But with SAINT-D, it is the first time Samsung has shown the use of stacked memory (3D Memory) which is installed directly on CPU, GPU or SoC components. With this technology, Samsung is seen to be able to offer a memory configuration on the SoC depending on what the customer needs. For example, NVIDIA's next graphics card, Rubin, is expected to use HBM 4 memory when it launches in 2026.
During the Samsung Foundry Forum event earlier, the company has announced that the installation of HBM 4 memory on this SoC is for the benefit of machine learning and artificial intelligence processing tasks and other computing tasks that require fast memory access.
Samsung says that their SAINT-D HBM 4 memory will start to be developed this year, and will be given to selected clients to be sampled and tested before it is mass marketed.
