With the acceleration of artificial intelligence technology that does not seem to show any reduction in the near to medium term, the need for larger and faster amounts of memory is increasingly important.
In fact, for ordinary users, the latest laptops that come with the nickname AI PC or CoPilot+ PC on average require at least 16GB of memory and the amount of TOPS AI processing to operate the newly introduced AI technologies.
Because of this, it is reported that JEDEC, the standards body for memory and storage technology has announced that they have introduced a new memory module standard for data centers, AI and even consumers.
If this year we have shown the CAMM2 module (Compression Attached Memory Module 2) started to be developed by companies such as Micron and Samsung, JEDEC will introduce new memory designs such as MRDIMM (Multiplex Ranked DIMM) and LPDDR6 CAMM2.
MRDIMM is a large memory module that can be used by data centers and even supercomputers for application processes that require a larger and faster amount of memory. This memory design is seen as the same as the memory design of existing server machines, allowing it to be used by data centers with existing equipment.
Second is CAMM2 memory which uses LPDDR6 memory chips. In a few more years, it is seen that consumer computers will start to switch to LPDDR6 memory, which will come with reading and data transmission speeds that are several times faster (14.4GT/s) than LPDDR5/5X (6-8GT/s ) which is used now.
The advantage of using CAMM2 memory is still the same as it is now: LPDDR memory no longer needs to be soldered to the laptop motherboard, allowing many, if not all, laptops in the future to be thin and light but still maintain high performance.
So far it is not known when these new memories will be shown, but it is expected to be officially introduced around the end of 2025 or the beginning of 2026.