Official Honor Magic V3 With Thinner Body, Snapdragon 8 Gen 3 Chip And IPX8



Honor Magic V3 was launched in China today with a thinner and lighter body than the previous generation. In the open state it is only 4.35mm thick and in the closed position it is only 9.2mm. At the same time the device also offers a weight of only 226/230 grams compared to 231/237 grams on the Magic V2.



Next, the device is equipped with a 7.92″ LTPO OLED main screen with a resolution of 2344×2156 pixels. Followed by a secondary 6.43″ LTPO OLED screen with a resolution of 2376×1060 pixels. Both sides of the screen also support a 120Hz refresh rate and have HDR. The Snapdragon 8 Gen 3 chip is used to power the device. Memory options are up to 16GB RAM with internal storage up to 1TB. The battery is also improved with a larger 5,100mAh capacity that can be charged by 66W wired and 50W wireless charging.




The included tri-camera supports a 50MP ultra-wide sensor, a 40MP ultra-wide angle and a 50MP periscope telephoto with OIS. Meanwhile, the exterior and interior selfie cameras each use 20MP sensors. Also included on the device is a side fingerprint scanner integrated on the power button, a DTS:X Ultra stereo speaker system, a red emitter to make it a remote control and IPX8 waterproofing. The device is sold at a starting price of RMB 8,999 (~RM5,788), RMB 9,999 (~RM6,431) and RMB 10,999 (~RM7,074) in China.

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