An active cooling system can ensure continuous consistent performance on mobile devices and at the same time solve the issue of fast draining batteries. But the majority of smartphones, tablets and laptops simply have a passive cooling system. The reason this happens is because active fans are thick and cannot be used on thin smart devices. But the firm xMEMS has launched an active cooling system only 1mm thick designed specifically for devices that want to maintain a thin design.
The XMC-2400 µCooling cooling system uses ultrasonic modulation to produce wind movement instead of a fan with an electric motor. This is the secret of why it is only 1mm thick and only 150 mg.
Although small it can move 39 cubic centimeters of air per second and produce a back pressure of up to 1000 Pascal. It can be placed directly on the surface of the SOC, GPU and battery in smartphones, tablets and thin laptops. More interestingly, it has IP58 waterproof and dustproof capabilities.
According to xMEMS, four manufacturers are already their customers with the first products expected to come out before the end of 2024. With the xMEMS cooling system, in the near future the issue of the phone getting hot when taking pictures and running firsts may be a thing of the past.