As you already know, Intel Lunar Lake processing components are certified to be built by Taiwan Semiconductor Manufacturing Company, and packaged and tested by Intel itself. This is because new Intel processes such as 20A and Intel 4 are not yet ready to manufacture their chips on a large scale.
In fact, it can be seen on the Intel Arc website itself that the Intel Core Ultra 200V processing chip is built using the TSMC N3B (3nm) process.
Recently, Intel has also confirmed that the same will be done for the production of their powerful desktop and laptop class processing chips, Arrow Lake, which will be launched around October this year.
The processing chip was previously reported to be built using their own 2nm (Intel 20A) process, but a statement released by Intel says that they will continue to develop their 18A (1.8nm) process technology which will be activated in 2025 and abandon the 20A process. .
Therefore, the Arrow Lake processing chip, which will be launched soon, will be manufactured most likely by TSMC, and packaged and tested by Intel itself, just like what was done for the Lunar Lake series of chips.
Intel also just announced today that they will be delaying the expansion of their CPU packaging and testing plant in Penang, with around 2000 people affected by this delay.