Taiwan Semiconductor Manufacturing Company (TSMC), the company responsible for manufacturing the majority of processing chips for smartphones and computers, has just introduced its latest manufacturing process technology called TSMC A14.
TSMC will also use denser second-generation nanosheet transistor components with NanoFlex Pro technology that promises to significantly improve the performance of processing chips.
According to TSMC, processing chips built with the A14 process will show a 10-15 percent performance increase at the same power consumption, 30 percent higher power efficiency at the same performance, and 1.2 times higher chip density compared to the current generation manufacturing process, N2.
The A14 technology node process will start operations in 2028, after the A16 technology, which is expected to start operations at the end of 2026. If you're confused about the use of the letter A compared to the previous N, similar to the Intel 18A process that will be operational this year, the letter is an abbreviation for the Angstrom scale, which is equal to 0.0000000001 meter.